Winbond Secures NT$15 Bln Loan for Fab Expansion
October 28, 2005
Taiwanese Winbond recently signed a five-year syndicated loan worth NT$15 billion, which it will use to expand production capacity at its 12-inch fab located in the Central Taiwan Science Park. Currently, monthly production capacity stands at 8,000 wafers, and the planned expansion will increase this number to 16,000 at the end of 2006 and 24,000 in 2007.